FIELD: heat sinks for electronic pieces of equipment. SUBSTANCE: device has thin-walled metal container with fusible working medium. Its cover is flat on underside and provided with metal pins immersed in fusible working medium. Electronic equipment component is placed on outer surface of cover. Heat-transfer apparatus is, essentially, thin-walled metal tube carrying cooling liquid. Part of heat-transfer apparatus held in container with fusible working medium is made in the form of coil arranged around metal pins of cover so that clearance of 10-15 mm is provided between pipe and pin. Liquid is forced through heat-transfer apparatus by means of pumping unit and cooled down by thermoelectric battery fed from power supply. Heat insulation is used to minimize influence of ambient temperature fluctuations. EFFECT: enhanced precision of temperature control, reduced size and simplified design of device. 1 dwg
Authors
Dates
2002-02-27—Published
2000-09-07—Filed