FIELD: process engineering.
SUBSTANCE: invention relates to means for bonding plastic materials, particularly, to electrical appliances for heating cutting tool or sealing plastic materials, polymer containers, etc. Proposed lamina plate is composed of disposal thermo electrical element from sheet copper. It is sized to 35×25 mm and features thickness of 100 mcm. Said plate comprises solid dielectric 18-19 mcm-thick layer and electrically conducting layer shaped to meander. Electrically conducting layer is composed of electrically conducting thermoset nickel-based 30-50 mcm-thick compound and 420-440 mcm-wide meander line. Dielectric layer is made of heat resistant heat conducting polymer. Plate allows operation at circuit resistance of 9.5 Ohm.
EFFECT: high strength and conducting properties.
3 cl, 7 dwg
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