TELECOMMUNICATIONS JACK HAVING MULTILAYER PRINTED-CIRCUIT BOARD Russian patent published in 2013 - IPC H01R13/646 

FIELD: radio engineering, communication.

SUBSTANCE: telecommunications jack has housing (2) having a port for receiving a plug, one-piece contacts (7) for connecting cable wires, connection contacts (4) for detachable connection with contacts of the plug, and a multilayer printed-circuit board (5) for electrically connecting the contacts (7) and the connection contacts (4). The printed-circuit board includes a free-floating ground bus formed from two outer layers of the board and a plurality of internal layers of the board, having a plurality of electronic components disposed thereon. Each of the two outer layers of the board has a continuous coating of electrically conductive material covering at least those layers of the board which have electronic components, wherein the continuous coatings of the outer layers of the board are electrically connected with each other and are electrically insulated from the internal layers of the board.

EFFECT: improved crosstalk suppression characteristics.

11 cl, 10 dwg