FIELD: process engineering.
SUBSTANCE: set of invention relates to abrasive powders intended for machining silicon ingots, to abrasive wire and to method of wire cutting. Said powder features granulometric fraction D40-D60 bearing over 15 vol % and less than 80 vol % of grains with roundness under 0.85. Abrasive wire for cutting silicon ingots comprises bearing wire containing said powder and grains binder. Proposed method of cutting silicon ingot allows making plate that feature thickness smaller than 200 mcm.
EFFECT: higher cutting efficiency.
19 cl, 2 dwg, 5 tbl
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