SUSPENSION OF ABRASIVE GRAINS Russian patent published in 2014 - IPC B24B27/00 B28D5/00 C09K3/14 C08J5/14 

FIELD: chemistry.

SUBSTANCE: present invention relates to a suspension containing a set of abrasive grains and binder. The suspension containing a set of abrasive grains and binder is characterised by that the particle size fraction D₄₀-D₆₀ of said set of abrasive grains comprises more than 15 vol.% and less than 80 vol.% of grains having a circularity of less than 0.85, the percentiles D₄₀ and D₆₀ being the percentiles of the cumulative particle size distribution curve of grain sizes corresponding to the grain sizes enabling the separation of the fractions consisting of 40 and 60 vol.% of the grains having the largest size, respectively; and the abrasive grains are more than 25% and less than 46% of the weight of said suspension. Also disclosed is an abrasive wire, a method of sawing a block based on silicon oxide and a method of machining an ingot.

EFFECT: disclosed suspension provides high rate of sawing, enables to produce wafers, particularly silicon wafers, having a very small thickness, of the order of 100 mcm, with a low reject rate.

15 cl, 6 tbl, 1 dwg