FIELD: chemistry.
SUBSTANCE: present invention relates to a suspension containing a set of abrasive grains and binder. The suspension containing a set of abrasive grains and binder is characterised by that the particle size fraction D40-D60 of said set of abrasive grains comprises more than 15 vol.% and less than 80 vol.% of grains having a circularity of less than 0.85, the percentiles D40 and D60 being the percentiles of the cumulative particle size distribution curve of grain sizes corresponding to the grain sizes enabling the separation of the fractions consisting of 40 and 60 vol.% of the grains having the largest size, respectively; and the abrasive grains are more than 25% and less than 46% of the weight of said suspension. Also disclosed is an abrasive wire, a method of sawing a block based on silicon oxide and a method of machining an ingot.
EFFECT: disclosed suspension provides high rate of sawing, enables to produce wafers, particularly silicon wafers, having a very small thickness, of the order of 100 mcm, with a low reject rate.
15 cl, 6 tbl, 1 dwg
