FIELD: chemistry.
SUBSTANCE: composition contains a system of epoxy resin which includes a reaction product of epoxy resin and a curing agent. The curing agent contains a first compound with an amino group of formula R1R2R3N, where R1 and R2 are independently an aliphatic or cyclic organic functional group and R3 is an alkyl group with 2-18 carbon atoms in the backbone chain; and a second compound with an amino group, with one or more primary or secondary amino groups, with stoichiometric ratio of -NH bonds of the second compound with an amino group to epoxy groups of the epoxy resin component of about 1:20-19:20.
EFFECT: invention reduces exothermic heat release during curing and improves physical and mechanical properties of the cured compositions.
23 cl, 3 dwg, 3 tbl, 15 ex
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