FIELD: process engineering.
SUBSTANCE: invention may be used for production of semiconductor micromechanical devices, for example, sensors of integrated transducers. Laminate pack of glass and monocrystal silicon is compressed at specified force and heated. Compressed laminate pack is isothermally cured at temperature exceeding that of sealing. After cooling of compressed pack to temperature lower than that of sealing constant voltage is applied to the pack with subsequent current control unless its termination.
EFFECT: higher precision of sensors, normal mechanical strength.
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR DIFFUSION WELDING OF SINGLE-CRYSTAL SILICON AND GLASS | 2022 |
|
RU2796482C1 |
| METHOD OF DIFFUSION WELDING OF SEMICONDUCTORS OR METALS WITH ALKALINE GLASSES | 1987 |
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SU975288A1 |
