PASSIVE COOLING SYSTEM FOR ELECTRONIC COMPONENTS OF PRINTED-CIRCUIT BOARDS Russian patent published in 2013 - IPC G06F1/20 

FIELD: information technology.

SUBSTANCE: passive cooling system for electronic components of printed-circuit boards includes heat pipes, condensation areas and evaporation areas of which are interfaced through thermal interfaces with a heatsink and surfaces of heat-dissipating elements of printed-circuit boards, respectively; the heat pipes are flexible, wherein for the printed-circuit board mounted horizontally and parallel to the heatsink, the heat pipes are placed vertically between each heat-dissipating element and the heatsink, and for printed-circuit boards lying perpendicular to the heatsink, the heat pipes are in form of parallelepipeds, the side and top surfaces of which are interfaced with surfaces of microchips of said boards and the heatsink, respectively, wherein the side surfaces of the parallelepipeds are the evaporation areas and the top surfaces are the condensation areas.

EFFECT: high efficiency of cooling owing to low thermal resistance of cross-over contact areas.

2 dwg