SYSTEM OF CONDUCTIVE HEAT REMOVAL FROM ELECTRONIC MODULES OF MAIN-MODULAR FORM FACTOR FOR PACKAGE ELECTRONICS PRODUCTS Russian patent published in 2024 - IPC H05K7/20 

FIELD: electronics; electronic equipment.

SUBSTANCE: invention relates to can be used to design a system for removing heat energy from heat-generating components of radio-electronic products—electronic modules. System of conductive heat removal from electronic modules of the main-modular form factor for package electronics products, including housing, wherein two inner opposite upper and lower walls of the housing are provided with ribs forming on the upper and lower walls of the housing a system of grooves located at intervals, corresponding to location interval of functional electronic modules of cPCI-Serial format with conductive heat removal system in housings protected from external factors, installed in the backplane, each module is equipped with a heat-removing plate protruding beyond the dimensions of the module, installed by means of mechanical attachment on printed circuit board of electronic module or on radiator of electronic module, wherein the plate is equipped on its two opposite edges with locks, fixing the plate in the grooves of the two opposite upper and lower walls of the housing by the bracing method, at that, the heat-removing plate simultaneously fixes the electronic module in the product housing, at least two power supply modules with backplanes are installed on the flat side walls of the housing, power supply modules are pressed through heat-removing plate by means of wedge locks to inner side walls of the housing with provision for reduction of thermal load on the upper and lower walls of the housing.

EFFECT: creation of system of conductive heat removal from electronic modules of main-modular system of form factor for package electronics products, meeting modern requirements for manufacturability, maintainability, reliability, resistance to external factors, durability, ease of installation and operation, with the possibility of using modern heat-emitting modules in the required quantity in the composition of the housing product.

8 cl, 6 dwg