FIELD: process engineering.
SUBSTANCE: invention relates to production of printed circuit boards from foil dielectrics by dimensional electrochemical treatment. Printed board conducting patter in negative picture is made at the surface of flat electrode tool. Prior to processing, said electrode tool is set parallel with foil dielectric surface, current being fed to foil dielectric from the side of electrolyte exit from spark gap. To rule out current isolated unprocessed islands, such electrolyte is used which features specific conductance decreasing at its motion through said spark gap owing to its heating and gas-filling.
EFFECT: higher quality of printed boards, lower time input, increased sizes of printed boards.
1 dwg
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