FIELD: technological processes.
SUBSTANCE: invention relates to electrochemical dimensional processing and can be used to obtain relief image on metal surface of articles, for example, in manufacture of shallow molds, embossing molds, printing plates, printed circuit boards and for marking parts. Method includes selective electrochemical etching of article surface in accordance with light image projected onto surface of semiconductor tool electrode, wherein tool electrode is rotated about fixed axis passing through center of surface of tool electrode, working surface of which is parallel to workpiece surface, and electrolyte supply to interelectrode gap is carried out through hole in the center of the tool electrode.
EFFECT: invention provides increase in accuracy and quality of treatment by improving conditions for elution from interelectrode gap of solid and gaseous products of electrochemical reactions, reduce in effect of products adsorbed on surface of tool electrode and workpiece and improve in hydrodynamic parameters of the process.
1 cl, 2 dwg
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Authors
Dates
2018-09-11—Published
2017-07-06—Filed