FIELD: process engineering.
SUBSTANCE: set of inventions relates to soldering of tubular polymer package. Proposed method comprises stages described below (a) Wrapping of laminar material (11). (b) Placing the laminar material edges (8, 9) nearby. (c) Extruding the softened polymer cord (12) to be placed at said edges (8, 9). (d) Smelting the edges (8, 9) to be bonded by cord (12). (e) Application of pressure to soldering zone (10). (f) Cooling of produced joint. Proposed device comprises vertical soldering rod coated by laminar material, softened polymer rod extruder and applicator to by applied between soldering rod outer surface and laminar material.
EFFECT: higher quality of soldered joint.
18 cl, 14 dwg
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