LIQUID COOLING SYSTEM OF ELECTRONIC DEVICE Russian patent published in 2014 - IPC H01L23/44 H05K7/20 G06F1/20 F28F9/07 

FIELD: machine building.

SUBSTANCE: unit is placed in a leakproof housing composed of two parts. The first (upper) part is a cover in the form of a hollow metal cylinder with semispherical end wall on the closed side and fitted by a flange - on the open side. The second (lower) part is a base on which all components of an electronic device are fixed. The electronic components are arranged inside the housing as follows: a group cooler on which the most heat releasing components are installed, is mounted on the base. Posts providing for fastening of a horizontal perforated shield above the said components are installed on the base, the remaining components with less heat release - printed circuit boards with radio elements - are mounted on the shield. The inlet hole provided in the cover is aimed at the supply of dielectric cooling liquid inside the housing, the liquid passes inside the housing and washes all electronic components cooling them, then it enters the channels present in the group cooler body providing for additional withdrawal of heat, afterwards it is drained through the outlet hole provided in the base. Internal channels increase the efficiency of heat transfer from the components installed on the group cooler. The cooling liquid is supplied to the housing under high pressure by means of an external pump and can be included in the common circulating flow of cooling agent of the whole spacecraft.

EFFECT: improved efficiency of cooling the devices comprising radio electronic components and power modules with different heat release levels, including those intended to be used in the state of weightlessness.

4 cl, 3 dwg