DEVICE FOR COOLING OF POWER ELECTRONIC MODULES Russian patent published in 2014 - IPC H01L23/36 H01L23/42 H05K7/20 

FIELD: electricity.

SUBSTANCE: device includes hollow case out of heat conducting material and consists of two parts, a base with rectangular cavity and a cap. Flat perforated plate dividing the cavity into two chambers is positioned inside the case parallel to the base bottom. Vertical partitions, one between the plate and cap, another between the plate of cavity bottom, are installed along two opposite plate edges not reaching to the case walls. Through holes for cooling agent feed/drain are made at the base bottom, near those two walls. Two other edges of perforated plate, and partition edges adjoin internal surfaces of case walls closely. To prevent plate bending and vibration, distance inserts are positioned at the plate surface at both sides. Perforated plate holes enable stream flow of cooling agent from one chamber to another chamber to the surface to be cooled, which is the base bottom with external side designed for attachment of electronic power modules. Perforated plate with partitions and distance inserts is attached to the cavity bottom by fixation elements. Maintenance cap is connected to the base by fixation elements through sealing pad, or just welded. Efficient cooling is ensured by irrigation of case base bottom with directed cooling agent streams while electronic modules are attached outside.

EFFECT: increased cooling efficiency due to string and reliable cooler design with large area for placement of cooled elements, simplified structure, better fabricability and simpler repair for obstruction.

4 cl, 1 dwg