FIELD: chemistry.
SUBSTANCE: invention relates to a curing composition for producing electrically insulating structural material for electrical or electronic components. The curing composition contains epoxy resin, a curing agent and a filler composition. The filler composition contains wollastonite and amorphous silicon dioxide. The surface of one of the fillers is treated with silane. A cured product is obtained by curing said curing composition.
EFFECT: invention enables to use said curing composition directly in the ceramic housing of a switching device and has high cracking resistance.
9 cl, 3 tbl, 2 ex
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