THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE Russian patent published in 2014 - IPC C08L63/06 C08K3/00 C08K3/34 C08K5/103 C08G59/42 H01L23/29 H01L23/31 H01L31/12 

FIELD: chemistry.

SUBSTANCE: invention relates to a thermosetting epoxy resin-based composition and a semiconductor device made using said composition. The composition contains (A) a reaction mixture of triazine-derived epoxy resin and acid anhydride with the ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6-2.0; (B) an internal parting agent; (C) a reflecting material; (D) inorganic filler; and (E) a curing catalyst. The internal parting agent (B) contains a carboxylate ester of general formula (1): R¹¹-COO-R¹² (1) wherein R¹¹ and R¹² denote C_nH_2n+1, where n is a number from 1 to 30, and a compound of general formula (2): wherein R^1, R² and R³ are independently selected from H, -OH, -OR and -OCOC_aH_b under the condition that at least one of R¹, R² and R³ includes -OCOC_aH_b; R is C_nH_2n+1 (in which n is an integer from 1 to 30), a ranges from 10 to 30, and b ranges from 17 to 61. The semiconductor device comprises a semiconductor element encapsulated a cured product of said thermosetting epoxy resin-based composition.

EFFECT: invention enables to obtain a homogeneous product which retains whiteness, heat-resistance and light-resistance for a long period of time with reduced yellowing.

8 cl, 12 dwg, 4 tbl