HEAT-RESISTANT ADHESIVES FOR CONNECTION OF CRYSTALS AND METALS WITH POLYIMIDE BASE Russian patent published in 2014 - IPC C09J179/08 C08G73/10 C08L79/08 C09J9/00 H01L21/52 

FIELD: chemistry.

SUBSTANCE: adhesives (compositions) contain as a polymer binding agent a novel prepolymer - poly(o-hydroxyamide) - product of the reaction of polycondensation of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and 1,3-bis-(aminopropyl)-tetramethyldisiloxane with isophthaloylchloride. In the process of the adhesive preparation for application, the exposure of a reaction solution, containing catalytic quantities of HCl, is carried out for 30-40 min. The connection of a crystal or metal to a polyimide base is realised at 200-270°C for 30-40 min.

EFFECT: films, formed from the claimed adhesives, form highly heat-resistant hydrophobic glue layers, which do not contain bubbles, the thermal processing of the said layers is realised at high temperatures, which does not cause the oxidation of metals in a metal wiring on the crystal.