THERMAL STABLE PHOTORESIST Russian patent published in 2015 - IPC G03F7/23 G03F7/75 G03C1/95 

FIELD: chemistry.

SUBSTANCE: invention relates to a thermally stable photoresist, which contains a reaction solution of poly(o-hydroxyamide) - the product of the polycondensation of isopthalic acid dichloride and 3,3'-dihydroxy-4,4'-diaminodiphenylmethane or a mixture of 3,3'-dihydroxy-4,4'-diaminodiphenylmethane and bis -(3-aminopropyl)dimethyl-siloxane, taken in a ratio from 9:1 to 1:9 mol. %, β,β-bis-naphthoquinonediazido - (1,2)-5-sulphoether-(4-hydroxyphenyl)propane and an amide solvent. It also additionally contains nigrosine black dye, with the following ratio of the said components being selected for obtaining the thermally stable photoresit, wt %: reaction solution of poly(o-hydroxyamide) 80-90; β,β-bis-naphthoquinonediazido - (1,2)-5-sulphoether-(4-hydroxyphenyl)propane 3.2-4.0; nigrosine black dye 0.6-1.4; amide solvent - the remaining part.

EFFECT: creation of the thermally stable photoresist for obtaining non-transparent highly thermally stable, adhesion-durable microrelief coatings, which do not pass light radiation, which increases the reliability of microcircuit work and increases the device service term.

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