FIELD: chemistry.
SUBSTANCE: invention relates to diamond-containing composite materials used in different fields of electronics as heatsinks. The method includes preliminary agglomeration of diamond powder by cold pressing said powder and temporary polymer binder followed by heat treatment at temperature of full removal of volatile substances from the temporary binder to obtain a porous workpiece and final agglomeration-sintering of the workpiece by soaking with liquid metal. Soaking of the porous workpiece during final agglomeration-sintering of the diamond powder is carried out with copper via capillary condensation of the vapour thereof at temperature in the range of 900-1000°C on the workpiece and reactor pressure of not more than 36 mmHg at temperature of the copper vapour higher than the temperature of the workpiece.
EFFECT: high efficiency of the articles as heatsinks while simplifying the production technology thereof.
1 tbl, 8 ex
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Authors
Dates
2015-07-10—Published
2013-11-07—Filed