FIELD: process engineering.
SUBSTANCE: invention can be used in soldering of porous materials with substrate for, for example, sealing of gas turbine engine blade ends or in fabrication of noise damping panels. Powder solder alloy with organic binder is arranged between porous material and substrate. Soldering is performed with application of pressure for solder compaction. Content of solder alloy liquid phase displacing in soldering is limited by 10% by maintenance of soldering working temperature at the temperature of solidus-liquidus range and/or addition of filler to said soldering alloy. Soldering alloy can be configured to 100-500 mcm deep tape. Organic binder can be represented by acrylic resin copolymer. Soldering agent or filler powder features particle size of 10-100 mcm.
EFFECT: reliable bonding at minimum change in porosity owing to impregnation of porous material by not over 500 mcm.
7 cl, 1 tbl, 1 ex
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Authors
Dates
2015-07-27—Published
2014-03-03—Filed