MOULDING COMPOUND BASED ON COPOLYAMIDE WITH STRUCTURAL UNITS OF TEREPHTHALIC ACID AND TRIMETHYLHEXAMETHYLENEDIAMINE Russian patent published in 2015 - IPC C08G69/26 C08L77/06 B32B27/34 D01F6/60 C08J5/04 

FIELD: chemistry.

SUBSTANCE: invention relates to copolyamide-based moulding compound, to moulded components, film, elementary fibres, as well as to fibrous composite material. Moulding compound contains at least 30 wt % of copolyamide, obtained from the following monomers: a) from 50 to 95 mol % of combination of diamine, selected from the group, including 1,9-nonandiamine, 1,10-decandiamine, 1,11-undecandiamine and 1,12-dodecandiamine, with terephthalic acid and b) from 5 to 50 mol % of combination of diamine, selected from the group, including 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine and their mixtures, with terephthalic acid. Quantities given in mole percent relate to the total quantity of a) and b) components. Copolyamide can contain to 5 mol % of structural units, derivatives of other monomers. Said moulding compound is used for obtaining moulded components, film, elementary fibres, and fibrous composite material.

EFFECT: invention makes it possible to obtain suitable for processing moulding compounds based on crystalline copolyamide, which is characterised by low water absorption.

8 cl, 1 dwg, 3 tbl, 11 ex