HEAT SINKS WITH C-SHAPED COLLECTORS AND MILLI-CHANNEL COOLING Russian patent published in 2016 - IPC H01L23/34 

FIELD: heating.

SUBSTANCE: invention relates generally to power electronics and, more particularly, to improved cooling for power electronics. The inventive heat sink (60, 70) for cooling at least one housing (20) of the electronic device comprises a lower cover (12), an upper cover (14) and a body (16) formed by at least one thermally conductive material. The body (16) is disposed between the upper and lower covers (12, 14) and is sealingly connected to them, while it limits the tapered input distribution chamber (136) configured to receive the coolant, the input C-shaped collectors (130) configured to receive the coolant from the tapered input distribution chamber (136), and inverse output C-shaped collectors (132) configured for discharging the coolant. The input and output collectors are alternated and arranged in a circular configuration. The output collectors extend around only part of the body and end near the opposite sides (135, 137) of the input chamber. The body of the heat sink also limits the tapering output chamber (138) configured to receive the coolant from the output collectors, and the input collectors extend around only part of the heat sink body and end near the opposite sides (131, 133) of the tapering output chamber (138). The milli-channels (34) formed in the heat sink body or at least in one of the covers, and configured to receive the coolant from the input collectors and feeding the coolant to the output collectors. The milli-channels are arranged radially, and the milli-channels, the input collectors and the output collectors are configured so that to cool one of the upper and lower contact surfaces of the housing of the electronic device.

EFFECT: creation is achieved of an improved design of heat sinks that impede the flow of the coolant on the electronics during assembly, disassembly or maintenance, as well as allow to use the effects of heat dissipation for improved cooling of power electronics, while providing low operating costs and increased heat transfer of high reliability, and also a large working stock.

9 cl, 15 dwg