FIELD: textiles, paper.
SUBSTANCE: invention relates to chip modules designed for labelling textiles, such as clothing. The RFID-chip module comprises a holder having a first major surface and a second major surface opposite the first major surface, the first recess structure disposed in the holder on the first major surface, and a chip located in the first structure of the holder recess. A figured metallisation layer is applied on the second major surface of the holder, at that the metallisation layer has a first metallisation structure and a second metallisation structure, at that the first metallisation structure is electrically isolated from the second metallisation structure. The chip is electrically connected to the first metallisation structure and the second metallisation structure. The RFID-chip module is suitable for connection to the textile substrate by laser soldering with flowing.
EFFECT: improvement of labelling of textiles.
12 cl, 8 dwg
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Authors
Dates
2016-04-20—Published
2012-08-07—Filed