FIELD: structural members.
SUBSTANCE: proposed structural member, for instance semiconductor component, has first integrated circuit disposed on second integrated circuit, both bearing first and second metal coatings facing one another, respectively, on one of their main surfaces. First metal coated areas are designed to electrically interconnect first and second integrated circuits. Newly introduced second metal coated areas are designed as additional electric functioning surfaces made beyond substrates of first and second integrated circuits.
EFFECT: facilitated implementation of additional electric functions.
10 cl, 8 dwg
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