METHOD OF CONNECTING FIRST ELECTRONIC STRUCTURAL ELEMENT WITH SECOND STRUCTURAL ELEMENT Russian patent published in 2015 - IPC H01L21/98 H04R31/00 H03H9/15 

FIELD: physics.

SUBSTANCE: invention relates to the technology of making piezoelectric devices, particularly a method of connecting piezoelectric monocrystals by low-stress active soldering for high-temperature use. A piezoelectric oxide monocrystal of a first structural element (1, 1a, 1b) is connected with a second structural element (1, 2, 2a, 2b, 4, 4a) using active solder (3). The active solder (3) is in direct contact with the piezoelectric oxide monocrystal of the first structural element (1, 1a, 1b). The first structural element (1, 1a, 1b) used is an acoustic surface wave structural element or an acoustic volumetric wave structural element. The piezoelectric oxide monocrystal of the first structural element (1, 1a, 1b) includes an acoustically active portion (9) and a contacting portion (8). The active solder (3) and/or at least one wire lead (5) are provided only on the contacting portion (8).

EFFECT: simple method for reliable connection of electronic structural elements, which include a low-stress piezoelectric oxide monocrystal which is stable at high temperatures.

9 cl, 1 tbl, 7 dwg