COMPOSITIONS FOR MOULDING AND REFORMING, INTENDED FOR ELECTRONIC DEVICES Russian patent published in 2016 - IPC C08L33/04 C08L101/00 C08L33/12 C08K5/3475 C08J5/00 

FIELD: instrument making.

SUBSTANCE: invention relates to composition for reforming components intended for electronic devices. Composition for reforming contains copolymer of [A]-[B]-[A], where [A] represents rigid block monomer, characterised by Tg value greater than 30 °C, and [B] is soft block monomer, characterised by Tg value smaller than 20°C, and copolymer [A]-[B]-[A] includes more than 35 wt.% of monomer [A], resin for imparting adhesiveness, and 0.05 to 5 wt.% (relative to total weight of composition) of UV-absorber selected from group including benzotriazoles, triazines and benzophenones. Block-copolymer component is present at content levels 50 wt.% or greater of total weight of composition for reforming. Composition has viscosity less than 75 000 cP at 210 °C, according to measurement complying with ASTM D3236 Document. Accumulation module (G') for composition is larger than 1×10⁷ din/cm² at 25 °C. Invention also discloses article, containing electronic component and composition for reforming, wherein softening temperature of composition is greater than 135 °C according to measurement complying with ASTM D6090 Document, and method for obtaining product of reforming over electronic component, involving application of composition for reforming upon electronic component at pressure less than 150 bar.

EFFECT: technical result is providing non-adhesive compositions for reforming, intended for injection molding at low pressure, which have high transparency, without any damage to sensitive electric or electronic components.

9 cl, 2 tbl, 1 ex