FIELD: chemistry.
SUBSTANCE: present invention relates to heat-conducting adhesive composition and to pressure sensitive adhesive tape, containing said composition, used for connection of components in electrical and electronic products. Heat-conducting adhesive composition contains based on total weight of composition: (a) 5–70 wt% epoxy component; (b) 5–60 wt% heat-conducting material selected from boron nitride, aluminium hydroxide or combinations thereof; (c) 0.001–10 wt% photoinitiator, which includes a mixture of triarylsulphonium hexafluorophosphate salts; (d) 0–40 wt% thermoplastic polymer; (e) 0–50 wt% hydroxyl-functional component; and (f) 0–50 wt% halogen-free fire retarder.
EFFECT: invention provides balanced combination of high strength of connection and high heat conductivity, as well as retardation of burning and high electrical insulation.
13 cl, 3 dwg, 2 tbl, 9 ex
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Authors
Dates
2017-01-19—Published
2012-09-29—Filed