METHOD OF MAKING SOLDER Russian patent published in 2016 - IPC B23K35/40 

FIELD: electroplating.

SUBSTANCE: invention can be used in making of solder for soldering of articles from copper and its alloys. Powder filler in the form of a mixture of copper and silver is filled up in the initial blank of tubular shape in the form of ampoules of copper. Filling of the filler is carried out using directed vibration with an amplitude of 3-5 mm with a frequency of 25-50 Hz. Blank is made leakproof and rolled in roll mill with return of blank for repeated rolling with decrease of its cross section. Volume of the ampoule is selected based on content of metal of the ampoule and filler in the solder. Copper phosphide with content of phosphorus from 20 to 30 % is used. Ratio of powders of copper and silver phosphide makes from 1.228:1.0 to 1.842:1.0.

EFFECT: method provides simplification of the production technological process with simultaneous provision of stability of properties of powder wire, allows to reduce the amount of defects during deformation of blank and reduce losses of materials, and also significantly increase uniformity of powder filler.

1 cl, 1 tbl, 5 ex