SOLDER FOR SOLDERING OF COPPER AND ITS ALLOYS AND METHOD OF ITS PRODUCTION Russian patent published in 1995 - IPC

FIELD: soldering of articles made of copper and copper alloys. SUBSTANCE: solder has the following constituents, mass percent: phosphorus - 3 to 7; aluminium - 0.01 to 0.199; silicon - 0.02 to 0.099; copper - the rest. The solder may contain also tin - 1.5 to 8 mass percent and/or zinc - 1 to 10 mass percent. The colder is produced by melting-down of copper-phosphorus charge, introduction of aluminium and silicon hardener into the melt and isothermal holding at a temperature ranging from 800 to 900 C for 1 to 10 minutes. EFFECT: facilitated procedure. 4 cl, 1 tbl