FIELD: materials.
SUBSTANCE: invention relates to film composites, in particular, method for production of composite film from polyarylenetherketone moulding compound and metal foil, as well as use of the film composite made by said method for production of the printed circuit boards retaining stability of dimensions. Proposed method of making composite film of polyarylenetherketone moulding compound and metal foil includes the following steps: I) preparation of film with thickness 5–1,200 µm from the molding mass containing the following components: a) polyarylenetherketone 60–96 wt%, b) hexagonal boron nitride 2–25 wt%, and c) talc 2–25 wt%, where the sum of weight parts of components a), b) and c) is 100, II) preparation of metal foil, thickness 10–150 µm; III) molding of the films prepared at the stages I and II without any adhesive at temperature from Tm-40 K to Tm+40 K and under pressure from 4 to 5,000 bar.
EFFECT: technical result is development of the method, which, using the film of polyarylenetherketone moulding compound with less shrinkage, as well as lower thermal surface expansion coefficient, by dry lamination with metal foil makes a composite with good adhesion and smooth surface.
10 cl, 1 tbl
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Authors
Dates
2017-01-10—Published
2012-04-20—Filed