METHOD FOR CONTROLLING A LASER CUTTING PROCESS AND LASER CUTTING SYSTEM IMPLEMENTING THE SAME Russian patent published in 2017 - IPC B23K26/38 B23K26/03 

FIELD: laser engineering.

SUBSTANCE: group of inventions relates to method and a laser cutting system. According to the invention, a laser cutting process is controlled, using as reference signal one or more emission lines, which are characteristic of the radiation, emitted by a assisting gas or a contaminant gas, present in the material volume, irradiated by the laser beam, focussed by laser head (12), based on the detected signal, at least one of the following process control parameters: power of the laser, frequency and the duty cycle of the laser pulse, pressure of an assisting gas, emitted by nozzle (16) forming part of laser head (12), relative speed of laser head (12) with respect to workpiece (P), distance between laser head (12) and surface (S) of workpiece (P), and the distance between focal point (F) of the laser beam and surface (S) of workpiece (P) are being adjusted.

EFFECT: technical result is improved quality of laser cutting.

12 cl, 12 dwg