FIELD: technological processes.
SUBSTANCE: invention relates to laser processing method and devices and can be used for material melting, evaporation or cutting under action of laser radiation. In device unfocused light (A) from light output point (B) is emitted on singlet lens (8). Lens (8) focuses laser light (A) and directs it to part (7) processing point. Distance (ma, mb) between lens (8) and light output point (B) and distance (la, lb) between lens (8) and part (7) processing point and distance between light output point (B) and said processing point may vary.
EFFECT: wherein, achieved are expanded operating performances of device and method, consisting in processing of parts with various thickness, and higher accuracy of laser processing.
40 cl, 6 dwg
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