FIELD: instrument making.
SUBSTANCE: invention relates to abrasive tools, intended for cutting into plates stone-like materials of high hardness (more than 8 on Mohs scale), for example, sapphire, used in production of electronic devices. Abrasive wire comprises long metal bearing base with cutting diamond layer in form of grains of working diamonds, distributed in peripheral layer attached to base. Metal bearing base is made undulating with size of working diamonds in rage of one grain fraction, that is, in diamonds of one fraction are used in making diamond wire.
EFFECT: higher efficiency of cutting process and low cost thereof.
1 cl, 3 dwg
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