FIELD: process engineering.
SUBSTANCE: invention relates to processing of hard and fragile non-metals, particularly, to silicon ingot cutter. Diamond wire saw includes cells of diamond wire webs wound on parallel reels to cut the blanks at table for cutting. Note here that diameter of at least one next web in direction of cutting of larger than that of previous web located ahead in cutting direction. This allows higher efficiency of silicon use for production purposes since made cuts are narrower while silicon plate depth is greater.
EFFECT: development of silicon ingot cutter.
11 cl, 8 dwg
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