FIELD: printing industry.
SUBSTANCE: in the printed circuit boards arrangement method, comprising a mutual arrangement of redundant and backup boards, redundant and backup boards arrangement and trace, the reference conductor is in the form of separate layers on the redundant and backup boards; the redundant and backup boards are glued with a dielectric layer having a relative dielectric capacity higher than that of the dielectric substrates of the redundant and backup boards; corresponding to each other routes of the redundant and backup circuits are arranged parallel to and under each other in the gluing dielectric layer; redundant and backup radio-electronic components are placed on the opposite glued sides of the redundant and backup printed circuit boards. In case of failure of a redundant circuit, the same technical result will be achieved in the backup circuit.
EFFECT: reduction of redundant circuit sensitivity to external conductive emissions and reduction of the conducted emissions level from the redundant circuit.
5 dwg
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Authors
Dates
2017-03-23—Published
2015-09-02—Filed