THERMOELECTRIC SEMICONDUCTOR DEVICE FOR CONTRAST THERMOODONTOMETRY WITH EVAPORATIVE COOLING SYSTEM Russian patent published in 2017 - IPC A61C19/04 A61F7/12 H01L35/28 F25B21/02 

FIELD: medicine.

SUBSTANCE: thermoelectric semiconductor device for contrast thermoodontometry with an evaporative cooling system comprises an actuating member with a thermoelectric system of exposure temperature change, and a temperature control and regulation unit associated with the temperature sensor. The actuating member consists of a set of removable attachments and a thermally conductive supporting unit. Each attachment consists of dielectric clamping plates of different shapes to be fixed on the tooth, a highly conducting gel pad, brought into contact with the tooth surface, a semiconductor thermoelectric module with projecting electrical terminals and an aluminium plate in the form of four-sided truncated pyramid to create a side guiding surface of the attachment. The pad is in thermal contact with hot junctions of the thermoelectric module, which reference junctions are in thermal contact with the aluminium plate and the inner surface of the gel pad comprises a temperature sensor. The supporting unit comprises a box with a handle, side walls and handle of which are made from a material with low thermal conductivity. The evaporative heat removal system is in the box cavity and is limited by aluminium plates from the outer and the inner side. Side walls of the support block have beveled guides at the bottom to insert and fix the aluminium plate of the actuating removable attachment, and two pairs of grooves with electrical contacts for the projecting electrical terminals of the thermoelectric module. The temperature control and regulation unit is equipped with a portable impact NC key connected to the power supply.

EFFECT: improved accuracy of diagnosis, monitoring and adjustment of exposure temperature, creation of a temperature gradient between the source and the adjacent teeth, improved device weight and size, improved contact with the tooth surface, reduced process inertia under changing temperature conditions, increased response account speed.

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