PROCESS OF TRANSFERING MICROSTRUCTURES ON FINAL SUBSTRATE Russian patent published in 2017 - IPC B44C1/17 

FIELD: technological processes.

SUBSTANCE: process of the invention implies that the film is subjected to the following operations for transfering during continuous production of flexible circuits: formation of microstructures thereon or transferring microstructures on the surface of the transferable film with consecutive transfer of microstructures from the transferable film on the surface of the final substrate. Microstructures are monolayer or multilayer structures consisting of cavities on the in fact flat surface, where the cavities are filled optionally or covered with another material; and of upwells on the in fact flat surface; or combinations thereof. Meanwhile the microstructures have one or more cured conformal layers of a release coating on their surface and are connected with the transferable film with one or more layers of a cured binder.

EFFECT: quality transfer of microstructures on the substrate is guaranteed.

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