FIELD: physics.
SUBSTANCE: pulsed laser radiation (1) is focused alternately on the front and back side of the object (5), which is moved along the predetermined processing path. When processing the front side, the laser radiation is directed by the mirror (3) and focused with the focusing system (4) on the front side of the object. When processing the back side of the object, the laser beam is directed to the opposite side by means of the mirror (2) and the mirrors (7, 8) and focused with the focusing system (6). The process parameters are set to achieve the maximum cutting speed, and the laser radiation is modulated to provide an optimum process at any given speed. If necessary, the cutting cycle of the front and back sides of the object is repeated until a through cut is obtained. The device comprises a laser (1), a frequency-pulse laser modulator, a two-coordinate table, on which the processing object is fixed (5), optical systems for focusing the laser beam on the front and back sides of the object (4, 6), a telescoping mirror (2) directing laser radiation by the mirrors (3 and 7, 8) into the beam focusing systems (4 and 6) on the front or back sides of the object (5). The device uses a copper vapour laser with a telescopic unstable resonator, the output mirror of which is made in the form of a meniscus with enlightened sides with a central mirror region.
EFFECT: providing high-performance cutting of various non-metallic materials, including sapphire, ceramics, and glass, along a specified trajectory with optimal control of the cutting parameters.
3 cl, 4 dwg
