FIELD: cutting.
SUBSTANCE: invention relates to cutting of non-metallic fragile materials, mainly glass, quartz and sapphire. Method of cutting brittle non-metallic materials involves local exposure on a cutting line by a pulsed-periodic laser radiation beam, wherein the energy is varied by exposing the near and middle infrared region to the total pulse length of 60–100 * 10-9 s, with frequency from 14 to 20 kHz and pulse energy from 0.35 mJ to 0.7 mJ, with average total radiation power at all wavelengths of 5–10 W. Pulsed laser beam is irradiated with simultaneous generation at 8 wavelengths in the infrared spectrum, respectively 1.03; 1.09; 2.6; 2.69; 2.92; 3.01; 3.06; 6.45 mcm. For curvilinear cutting, first, contour of the figure is set with focused laser radiation with focal spot diameter of 60–100 mcm and total radiation power below 5 W, with further implementation of additional passage with increased diameter of focal spot to 500 mcm, total radiation power 7–10 W.
EFFECT: invention can be used in production of smartphones and any other devices with touch panels, in making electrical and microelectronic devices.
3 cl, 2 dwg
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Authors
Dates
2019-05-21—Published
2018-07-06—Filed