FIELD: radio engineering and communication.
SUBSTANCE: invention relates to the production of radio equipment using microchips. Lead former of microcircuit terminals contains located on a common base the center-of-gravity node of housing position of microcircuit, the manipulator for capturing the microchip package that is space-oriented in the center-of-gravity node, the displacement mode of space-oriented in the center-of-gravity node microchip package for its supplying into the unit for forming and cutting the terminals. Center-of-gravity node of housing position of microcircuit is made in the form of two centering jaws with angled notches facing each other and spring-loaded to move these jaws towards each other, and contains a lever connected to one of the centering jaws for diluting these jaws to position the chip body between them. Manipulator comprises a gripping unit disposed turntable on a vertically oriented axis passing through the geometric center of the projection of the microchip package in a plan when placed in a centering unit, which is made in the form of two vertically spaced apart jaws that can cover the microchip package from above and from below and move towards each other before contacting the surfaces of the microchip body when turning in one direction and moving the package to the node point for forming and cutting the terminals when turning in the opposite direction. Node for molding and cutting the terminals is a matrix located on the base with a portion of the surface for laying the terminals of the microcircuit from one side of the housing, carrying a stepped portion for bending the terminals, and a punch carrying a forming part in the form of three plates, one of which is adapted to press the terminals adjacent to the housing to the surface for laying the terminals of the chip, the other – to bend the terminals on the stepped part of the matrix, and the third, made with a beveled end, for end trimming of the bent terminals, wherein the punch is provided with a transfer drive in the direction towards the microcircuit terminals for sequentially moving at first the first plate, then alternately the second and third plates.
EFFECT: invention provides an improvement in the quality of terminals molding and the ability to mold and cut microcircuits of various types of housings and terminals.
2 cl, 11 dwg
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|
RU2657519C1 |
DEVICE FOR PREPARING LEADS OF INTEGRATED CIRCUITS TO WIRING | 0 |
|
SU1117868A1 |
DEVICE FOR FORMING LEADS OF ELECTRIC RADIO ELEMENTS | 2024 |
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RU2824455C1 |
DEVICE FOR SETTING,SHAPING AND TRIMMING THE LEADS OF MICROCIRCUITS | 0 |
|
SU1358117A1 |
DEVICE FOR FORMING AND TRIMMING TERMINALS OF UNPACKAGED MICROCIRCUITS | 0 |
|
SU1632574A1 |
DEVICE FOR FORMING MICROCIRCUIT LEADS | 0 |
|
SU1103928A1 |
LINE FOR PREPARING MICROCIRCUITS FOR WIRING | 0 |
|
SU1023687A1 |
APPARATUS FOR SHAPING AND TRIMMING THE LEADS OF ELECTRONIC COMPONENTS | 0 |
|
SU740423A1 |
DEVICE FOR MOULDING LEADS OF MICROCIRCUITS | 0 |
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SU1559447A1 |
0 |
|
SU365871A1 |
Authors
Dates
2018-02-07—Published
2016-12-27—Filed