DEVICE FOR ALIGNING SIDE ELECTRICAL TERMINALS OF A MICROCIRCUIT CHIP RELATIVE TO THE BOTTOM OF THE HOUSING OF THE MICROCIRCUIT CHIP OR ITS LOWER CENTRAL CONTACT Russian patent published in 2025 - IPC H05K13/02 

FIELD: electric elements.

SUBSTANCE: invention relates to devices for preparing electrical components for surface mounting on printed-circuit boards. Device for aligning side electrical terminals of a microcircuit chip relative to the bottom of the housing of the microcircuit chip or its lower central contact comprises a base part and a forming part oppositely above it, aligned with each other along their own vertical symmetry planes, coinciding with the vertical longitudinal plane of symmetry of the microchip device mounted in the base part recess, made with the possibility of vertical convergence by a controlled distance, forming part of the device comprises a holder of the forming element and the forming element itself, capable of bending to the required depth the sections of the side outputs of the microchip suitable for mounting relative to the base for levelling the plane of the housing of the microchip, wherein the forming element is a flexible variable-shape die in the form of a thin and elastic plate, the length of which considerably exceeds the total width of the microcircuit, and the width is not less than the length of the housing of the microcircuit, made with the possibility of bending after touching by its central part the bottom plane or the central contact of the chip body, as well as the ability to deform the side outputs of the chip to a depth compensating their resilience, holder holds the puncheon by its short sides, providing the possibility of bending the puncheon along the arc.

EFFECT: creation of a small-size device with a simple design, which does not require high accuracy during manufacture, with high accuracy of adjusting the bending depth, which compensates for springing of microcircuit leads.

10 cl, 9 dwg