FIELD: lighting.
SUBSTANCE: light-emitting device containing substrate (6) having a conductive layer (8) of conductors, a LED assembly (7) mounted on the surface of the substrate (6) and electrically connected with a layer (8) of conductors, and heat sink element mounted on the surface of the substrate (6) apart from the LED assembly (7). The heat sink element has a body (2) of heat conducting material surrounding the LED assembly (7). Body is thermally coupled with a layer (8) of conductors and made with the ability to allow for the dissipation of heat from the layer (8) of conductors to the environment, in which the surface (3) of heat sink element faced to LED assembly is made with opportunity form a part of an optical device for forming beam for forming light, radiated by LED assembly.
EFFECT: as the heat sink body is in thermal contact with the conductor layer, the heat resistance from the LED assembly to the heat sink body through the conductor layer is reduced.
10 cl, 15 dwg
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Authors
Dates
2018-02-15—Published
2013-03-06—Filed