FIELD: electrical engineering.
SUBSTANCE: light emitting diode (LED) device is intended for installation on a heat sink having a front surface with a hole therein. The device includes a substrate, at least one LED crystal mounted on the substrate and a thermally conductive core having the first and the second sections; the first section is thermally connected to the substrate while the second section has a pin projecting therefrom to the outside. The said substrate is positioned on the first section of the thermally conductive core that is opposed to the second section of the thermally conductive core. The in is functionally configured so that to be inserted in the heat sink hole so that the second section is thermally connected to the heat sink front surface. Additionally disclosed are other implementation versions for the LED device installation with the help of an adhesive thermally conductive material, spring clamps, insert latches or welding.
EFFECT: improved transfer of heat from light emitting diodes to the body part.
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Authors
Dates
2013-06-10—Published
2008-12-11—Filed