FIELD: electricity.
SUBSTANCE: device of current transmission consists of LED modules and conductive profiles. LED modules are printed circuit boards with front-soldered LEDs, and longitudinal bond pads are located in the rear part of the printed circuit board. The bond pads are conductive tracks or contact tracks or contact elements soldered onto the surface of the printed circuit board. The conductive profiles are made of metal alloys with low resistance to electric current. LED modules are lined up in straight lines, and the bond pads form straight lines of contacts. The conductive profiles are mounted on the group of LED modules in such a way that the contact surfaces of each conductive profile directly touch the lines of the bond pads or contact elements of the LED modules. As a result of contact, an electrical contact arises that allows, when applying a potential difference to the aluminium profiles, the electric current to flow between the conductive profiles through the LED modules. When the current flows through the LED modules, the LEDs emit light.
EFFECT: transfer of the current, reaching hundreds of amps, with low voltage, to the LED modules by the distance up to 10 m, reduced current load on the printed circuit boards, temperature of LEDs operation, simplification of the installation of LEDs.
2 cl, 15 dwg
