METHODS OF TRANSFERRING ELECTRICALLY CONDUCTIVE MATERIALS Russian patent published in 2018 - IPC H05K3/20 

FIELD: technological processes.

SUBSTANCE: invention relates to methods for forming a laminated structure with an electrically conductive material, methods for transferring an electrically conductive material, and devices with electrically conductive materials formed by said methods. Method of transferring an electrically conductive material to a substrate includes: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 93 to 232 °C (200–450 °F) and at a pressure ranging from 207 to 1,034 kPa (30 to 150 psi), such that the electrically conductive material adheres to the substrate. In addition, methods for forming a laminated structure are disclosed.

EFFECT: development of a fast, reliable, cost-effective and/or environmentally friendly method for transferring electrically conductive materials to substrates, especially to substrates used in wireless communication devices.

15 cl, 10 tbl