FIELD: instrument engineering.
SUBSTANCE: assembly of a multicrystal encased apparatus comprising a primary device and at least one secondary device connected as a planar array to the substrate, first passive heat exchanger comprising a heat radiator base and a rib structure disposed on the primary device and having an opening above the region corresponding to at least one secondary device, second passive heat exchanger, containing the heat radiator base and rib structure, located in a hole in at least one secondary device, at least one first spring for applying force to the first heat exchanger towards the primary device and at least one second spring for applying force to the second heat exchanger towards the secondary device.
EFFECT: invention makes it possible to improve the possibility of cooling each component in a multicrystal cased article.
8 cl, 6 dwg
Title | Year | Author | Number |
---|---|---|---|
THREE-DIMENSIONAL ELECTRON MODULE | 1997 |
|
RU2133523C1 |
INFORMATION STORAGE AND PROCESSING DEVICE (ISPD) | 2008 |
|
RU2398279C2 |
3D ELECTRONIC DEVICE | 2011 |
|
RU2488913C1 |
THREE-DIMENSIONAL ELECTRON MODULE AND PROCESS OF ITS MANUFACTURE | 1998 |
|
RU2176134C2 |
METHOD OF BUILDING WLCSP COMPONENTS IN E-WLB AND E-PLB | 2014 |
|
RU2655678C1 |
METHOD FOR PRODUCING THREE-DIMENSIONAL MULTICHIP MICROMODULE | 2005 |
|
RU2299497C2 |
CONTACTING DEVICE | 2012 |
|
RU2498449C1 |
LIGHT-EMITTING DIODE LIGHT SOURCE (VERSIONS) | 2013 |
|
RU2569312C2 |
CASE FOR ELECTRONIC EQUIPMENT | 2013 |
|
RU2533076C1 |
LIGHT DIODE SOURCE OF RADIATION | 2008 |
|
RU2392539C2 |
Authors
Dates
2018-08-22—Published
2014-09-27—Filed