3D ELECTRONIC DEVICE Russian patent published in 2013 - IPC H01L25/00 H01L25/04 

FIELD: electrical engineering.

SUBSTANCE: 3D electronic device is designed in the form of a cylindrical or pyramidal frustrum or a figure composed of their combinations immediately connected to each other; the microboards have external contacts at their butt-ends, the said contacts electrically connected to the microboards components with the 3D electronic modules are equipped with external contact fields positioned on their butt-ends or faces. The external switching board may be designed in the form of a flexible printed board with contact fields for connection to any surface of the 3D modules; the external contact fields may be made of flat zones (coated with a current-conductive material and connected to the external switching board, such zones positioned on the external butt-ends of each 3D module) or console-type metal or polymer metallised contacts (protruding outside the 3D electronic modules dimensions and electrically connected to the external switching board). Considered are cases when the external switching board design enables universalisation of 3D electronic modules of arbitrary spatial configuration.

EFFECT: creation of a 3D electronic device with a configuration of arbitrary spatial shape, ensuring achievement of optimal characteristics with virtually any electronic hardware and especially efficient for purposes of creation of superhigh-speed ground-based or on-board computer complexes.

10 cl, 12 dwg