THREE-DIMENSIONAL ELECTRON MODULE AND PROCESS OF ITS MANUFACTURE Russian patent published in 2001 - IPC

FIELD: manufacture and assembly of electronic equipment. SUBSTANCE: standard packaged components and/or microboards with unpackaged active and passive components and face surfaces to them and at least one connection board having electric and mechanical contact with them are located between printed switching boards with metallized holes placed in parallel. Heat removing comb partially embraces case of packaged component or base of specified microboard and has at least one protrusion or plane having heat contact with external heat removing system. Case of packaged component and base of specified microboard are made of heat-conducting material. During replacement of defective packaged component or microboard their leads-out are unsoldered by group tool from parallel printed switching boards. These leads-out are simultaneously bent and withdrawn from metallized holes of printed switching board. Defective component or microboard is displaced into clearance between printed switching boards and is withdrawn outside. EFFECT: versatility of design, increased density of installation and efficiency of heat removal with preservation of maintainability. 15 cl, 11 dwg