FIELD: binder compositions. SUBSTANCE: binder composition involving epoxy diane resin, tetrabromophenylolpropane, hardener a mixture of aromatic diamines and organic solvent, has additionally 3,3'- dichloro -4,4' -diaminodiphenylmethane, hardening catalyst and arsenic (III) glycolate as its 50-90% solution in ethylene glycol or ethylcellosolve at the following ratio of components, mas. p. epoxy diane resin 100; tetrabromodiphenylolpropane 6-15; mixture
of 4,4'-diaminodiphenylmethane and 3,3'- dichloro -4,4'- diaminodiphenylmethane 8.2-15.5; arsenic (III) glycolate as 50-90% solution in ethylene glycol or ethylcellosolve 5.8-50.2; hardening catalyst 0.2-0.4, and organic solvent 135-205. Composition is used radio engineering, electroengineering, electronics. EFFECT: increased refractory property, decreased cost, simplified technology, retained strength and insulating properties. 2 tbl
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POLYMER BINDER FOR REINFORCED PLASTIC | 2006 |
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EPOXY BINDER FOR POLYMER COMPOSITE MATERIALS | 2012 |
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0 |
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FLEXIBLE HEATING ELEMENT | 2008 |
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EPOXY BINDER FOR REINFORCED PLASTIC | 2009 |
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0 |
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SU1776667A1 | |
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RU2148605C1 |
Authors
Dates
1995-11-10—Published
1994-04-28—Filed