FLEXIBLE PRINTED CIRCUITS CONNECTION METHOD Russian patent published in 2019 - IPC H05K3/36 

FIELD: technological processes.

SUBSTANCE: invention relates to an improved method of connecting flexible printed circuits to each other, in particular, to a thermal connection of two circuits with the same pitch of interconnections. Effect is achieved by: providing first gasket (32) on holder (26), placing first substrate (10) on holder, wherein first side of first substrate is in contact with first gasket, and second side of first substrate includes first plurality of electric conductors (12). AC-binder material (18) is applied to the first set of electric conductors, second substrate 14 is combined with the first substrate. First side of the second substrate has a second plurality of conductors (16), and the second plurality of conductors are aligned with the first plurality of conductors such that the AC bonding material is placed between the first side of the first substrate and the first side of the second substrate. Second gasket (28) is provided on the second substrate, heat is brought and pressure is applied to the second gasket to form an AC connection between the first and second plurality of conductors, wherein the first and second gaskets are made of heat-resistant and resilient material to enable substantially uniform application of pressure and heat supply on the first and second sets of electrical conductors when forming the AC connection.

EFFECT: improved method of ACF-connection (connection by means of anisotropic conductive films) for reduction of misalignment at formation of conductive, stable interconnections of two printed-circuit boards (PC), in particular, for interconnections with fine pitch.

19 cl, 11 dwg